We are looking for an experienced Lead Engineer – OS / BSP to lead system software architecture, BSP development, and low-level software integration for high-performance automotive platforms.
Job Description
Take ownership of system software architecture, BSP, and low-level driver development.
Collaborate closely with India-based engineering teams and international stakeholders.
Analyse requirements, system architecture, implementation, and validation documents.
Develop and integrate BSP and low-level software for high-performance automotive SoCs.
Work with Qualcomm and/or NVIDIA-based platforms.
Develop and debug software on QNX and RT-Linux/POSIX systems.
Work on kernel internals, multi-threading, IPC, and memory/resource management.
Support hypervisor technologies, hardware virtualization, and guest OS integration.
Work with ARM-based architectures and low-level system software.
Support platform bring-up, system integration, debugging, and validation.
Perform root cause analysis and support resolution of technical issues.
Create and maintain technical documentation and knowledge repositories.
Requirements
8+ years of experience in system software architecture, BSP, and low-level driver development.
Strong experience with QNX and RT-Linux/POSIX systems.
Strong understanding of kernel internals, multi-threading, IPC, and memory/resource management.
Experience with Qualcomm and/or NVIDIA automotive SoCs.
Strong knowledge of ARM architecture.
Hands-on experience with hypervisor technologies and hardware virtualization.
Experience with platform bring-up and system integration.
Strong C/C++ and embedded systems knowledge.
Automotive experience is highly preferred.
Good Chinese and English communication skills, both oral and written.
Willingness to travel frequently or on a need basis to Huizhou is a must.
Preferred location: Huzhou; second preference Shenzhen.
About RainTech
Hire, onboard, and manage tech talent in Southeast Asia. Automated compliance, payroll, and benefits for distributed teams.
